| 摘要 |
PROBLEM TO BE SOLVED: To provide a composite material having a thermal expansion coefficient resembling that of a semiconductor element or a packaging material such as a ceramic and having an excellent thermal conductivity, and suitable to be used as a heat dissipating substrate to be mounted on a substrate for mounting a semiconductor substrate. SOLUTION: A honey-comb structure with a numerous hole-like spaces is manufactured of a low thermal expansion material with high rigidity such as a tungsten, molybdenum or an alloy of these materials, and metal material with a high thermal conductivity such as a copper is impregnated into the honey-comb spaces of this structure to form the composite material.
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