| 摘要 |
PROBLEM TO BE SOLVED: To suppress an electromagnetic wave fault due to a leakage or a reflection of an electromagnetic wave generated from a semiconductor element or the like and to increase a hermetical sealability of a package. SOLUTION: A package for housing the semiconductor element comprises a base 1, a frame 2 and a cover 3, and an internal space 7 formed therein to house the semiconductor element 5. At least one of the base 1, the frame 2 and the cover 3 has a radio absorber in which a soft magnetic powder of 60 to 99 vol.% is dispersed in a thermosetting resin, and a dense layer having a smaller permittivity than that of the absorber and provided on a surface contacted with at least the space 7 of the absorber. |
