| 发明名称 |
System for plating planar articles |
| 摘要 |
A wafer plating system horizontally transporting vertically oriented wafers into one or more process cells. The wafer processing system includes a carrier rotatable from a substantially horizontal orientation to a substantially vertical orientation. A cathode assembly secures the wafer onto the carrier and electrically couples the wafer to a power supply.
|
| 申请公布号 |
US2003010626(A1) |
申请公布日期 |
2003.01.16 |
| 申请号 |
US20010907332 |
申请日期 |
2001.07.16 |
| 申请人 |
GRAMAROSSA DANIEL J.;DOWNES GARY C. |
发明人 |
GRAMAROSSA DANIEL J.;DOWNES GARY C. |
| 分类号 |
C25D7/12;H01L21/288;H01L21/677;(IPC1-7):C25D17/00;C25C7/00;C25B9/00;C25F7/00;B23H11/00;B23H7/26;C25D17/04;C25D17/06;C25D17/16 |
主分类号 |
C25D7/12 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
