| 摘要 |
An electronics enclosure implementing a cooling system and method enables much higher power densities in air-cooled electronic enclosures. The system includes an air streaming or "tunneling effect" ventilation system, including an enclosure that functions as a heat transfer component of the system, that efficiently removes warm air from the interior of the enclosure. The ventilation system comprises an array of intake fans on a first side panel of the enclosure, and array of exhaust fans on an opposing side panel of the enclosure, and a substantially unobstructed channel between the side panels. Additionally, and external heat exchanger is provided that is integrated with the enclosure for dissipation of heat from high-density powered components such as hard drives. The system further includes a thermoelectric cooling module with a heat exchanger and an optional externally ported CPU fan to achieve superior heat dissipation from the CPU.
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