Electronic circuit device

摘要

According to an electronic circuit device, when a circuit board having electrical parts mounted thereon is sealed with resin, the heat and pressure of the resin is prevented from acting on the electrical parts thus mounted. A circuit board (10) having electrical parts (11) and an IC (12) mounted thereon is accommodated in a sleeve formed of a thermal-shrinkage film (16), and subjected to thermal shrinkage to intermediate-package the circuit board. Thereafter, the overall body thereof is molded with a resin (17) and the circuit board (10) is sealed.