| 摘要 |
<p>A method for producing a multilayer wiring circuit board with high reliability by securing a sufficient adhesive strength at the interface between a conductive layer formed on the board and a thermosetting adhesive layer and thereby increasing the adhesive strength between the conductive layers. A thermosetting adhesive layer (15) is formed on a first conductive layer (12). An opening (14) is formed in the thermosetting adhesive layer (15) and filled with a solder powder (17) at a normal temperature. A second conductive layer (23) is formed on the thermosetting adhesive layer (15) and over the opening (14). The solder powder (17) is heated and melted so as to electrically interconnect the first and second conductive layers (12, 23).</p> |
