| 摘要 |
The electronic component comprises a support (51) carrying a substrate (21) with a power electronic device (11) and a cover comprising thermally conducting columns (41) positioned on the support (51), and a heat sink (31) covering the surface of the columns and of the electronic device. The electronic device is a transistor or a set of transistor of type holder or amplifier. The support also comprises low-temperature solder layers (Bb1,Bb2,Bb3) whose fusion temperature is lowre than that of the solder utilized in the assembly of the heat sink and the electronic device. The transistor is a bipolar transistor with heterojunction. The electronic device (11) is constituted of a pile of layers of materials from the groups III-V. The support (51) is made of a dielectric material such as Al2O3 or AlN, and comprises a double-layer structure of dielectric material incorporating metallic elements; or the support is made of high thermal conductivity material having the coefficient of thermal expansion compatible with that of the substrate. The electronic component comprises means for circulating a heat-carrier fluid integrated at the level of the support, which is constituted of a pile of locally perforated sheets, and also comprises micro-channels. The heat sink and/or the support comprise feedthroughs for the input/output electrical connections of the electronic device. The solder layers ensure the contact between the electronic device and the heat sink and/or between the substrate and the support. A method for manufacturing the electronic component comprises the steps of implementing the electronic device on the substrate, assembling the heat sink with the electronic device surface, and further with the support surface by the intermediary of the columns. The assembly of the heat sink with the electronic device surface is carried out by thermocompression, or by a first soldering. The assembly with the support surface is carried out by a second soldering. The fusion temperaure of the first soldering is higher than that of the second soldering. The soldering operations are carried out in a dehydrogenated medium. |
