| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition for sealing not containing especially halogens (chlorine and bromine) and antimony oxide, with good flame- retardancy, moldability, continuous productivity and reliability through purity regulation of a phosphorus-nitrogen compound, and to provide an electronic parts sealed device. SOLUTION: This resin composition for sealing comprises (A) an epoxy resin, (B) a phenolic resin, (C) a phosphazene compound with chlorine ion concentration of 50 ppm or less when extracted at 95 deg.C for 24 hours, and (D) an inorganic filler as essential components, wherein the phosphazene compound (C) is 0.05 to 1 wt.% in terms of phosphorus content and the inorganic filler (D) is 60 to 95 wt.% in the composition, respectively. This electronic parts sealed device is formed by sealing electronic parts with the cured product of the resin composition for sealing.
|
