RESIN COMPOSITION, FILM WITH ADHESIVE FOR SEMICONDUCTOR DEVICE, LAMINATED FILM WITH METALLIC FOIL AND SEMICONDUCTOR DEVICE USING THE LAMINATED FILM

摘要

PURPOSE: A resin composition, a film with an adhesive for a semiconductor device, a laminated film with a metallic foil and a semiconductor device using the laminated film are provided, to reduce the thermal expansion coefficient and to improve the elastic modulus of a resin composition and to improve the reflow resistance and the adhesive strength of an adhesive. CONSTITUTION: The resin composition comprises a phase separation structure having at least two phases; and 5-50 wt% of an inorganic fine particle having an average primary particle diameter of 0.1 micrometers or less. Preferably the phase separation structure has a matrix phase or a disperse phase. The resin composition exhibits an elastic modulus of 25 MPa or more after cured at a temperature of 150 deg.C. The film with an adhesive comprises an organic insulating layer; and an adhesive layer comprising the resin composition formed on at least one surface of the organic insulating layer. The laminated film comprises the film with an adhesive; and a metallic foil laminated on the adhesive layer of the film.