APPARATUS AND METHOD FOR FABRICATING TBGA SEMICONDUCTOR PACKAGE

摘要

PURPOSE: An apparatus and a method for fabricating a TBGA(Tape Ball Grid Array) semiconductor package is provided to improve a filling ratio in a process for filling a solder material into a via hole by using an additional apparatus. CONSTITUTION: A stiffener(43) is adhered on a bottom face of a circuit tape(41) by using the first adhesive(42). A heat-sink plate(45) is adhered on a bottom face of the stiffener(43) by using the second adhesive(44). A semiconductor chip(46) is mounted on a cavity(43a) of the stiffener(43). A circuit tape(41) has a circuit pattern layer(41b) formed on a film(41a) formed with polymer resin and a photo solder resistor(41c) on which the circuit pattern layer(41b) is not formed. The semiconductor chip(46) is connected with the circuit pattern layer(41b) by using the first wire(47a). A wire bonding portion between the semiconductor chip(46) and the circuit pattern layer(41b) is molded by a molding material(48). The first solder ball(49a) is adhered on an upper face of the circuit pattern layer(41b). A via hole(400) is formed on the circuit tape(41). A plating layer(410) is formed on a bottom face of the via hole(400). The via hole(400) is filled by a solder material(420). The solder material(420) is adhered on the second solder ball(49b). The semiconductor chip(46) is boned with the plating layer(410) by using the second wire(47b).