| 摘要 |
PROBLEM TO BE SOLVED: To reduce the working time to improve the productivity by simplifying the production process. SOLUTION: A first low-m.p. metal material 12 is disposed a little on a wiring pattern 3, wire 13 made of a second metal material having a higher m.p. than that of the first material 12 is disposed like a half loop to cover the first material 12, the pattern 3, first material 12 and wire 13 are heated to melt only the first material 12 enough to fill a region surrounded with the wire 3 and pattern 3 and then cooled to form a contact bump. The wire bonding technique is applicable to the disposition of the metal material 12 and wire 13. |
