| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device in which the outer shape size of a package can be made compact irrespective of the kind of a semiconductor chip to be mounted. SOLUTION: Each central part X in three chip mounting substrates 2 to be laminated in three layers, each central part Y in the whole arrangement of a plurality of intermediary terminals 5 installed on a first main face 2a on which the semiconductor chip 3 is mounted on the respective substrates 2 so as to surround its chip mounting position to be adjacent from its outer side, and each central part Z in the whole package of the semiconductor device 1, are made to agree. The chip 3 is mounted by using a flip-chip method or the like in an offset position in which the central part C of the chip 3 is decentered by a prescribed distance A to a prescribed direction from the respective central parts X, Y, Z, in order to enhance the flexibility of routing chip connecting interconnections 6 used to electrically connect a plurality of pads 19 which are installed in the chip mounting position on the main face 2a, and which are electrically connected to respective terminals 4 of the chip 3 to the plurality of intermediary terminals 5 electrically connected to the respective pads 19. |
