| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a wiring board and its manufacturing method in which reliability of connection with an electronic component is enhanced by substantially equalizing the diameter on the top face of flattened solder bumps regardless of presence/absence of a solid layer. SOLUTION: The method for manufacturing a board 1 comprises a solder paste printing process for coating a plurality of pads 22 opening to the major surface 2 side with solder paste, a reflow process for forming substantially hemispheric solder bumps by fusing the applied solder paste, and a flattening process for forming flattened solder bumps 25 by pressing the top part of the substantially hemispheric solder bumps with a flat pressing plane. In the solder paste printing process, a first pad 22B where a solid layer 21 is formed in the projection region of the pad 22 on the rear surface through one or a plurality of resin insulation layers is coated with a smaller quantity of solder paste than a second pad 22C where the solid layer 21 is not present in the projection region of the pad 22 on the rear surface.</p> |
