CHIP THERMISTOR

摘要

PROBLEM TO BE SOLVED: To provide a bump mounting chip thermistor which is advantageous to a reduction in mounting area. SOLUTION: A pair of terminal electrodes 6 and 6 is provided along the two opposed edges of the undersurface of a rectangular parallelopipedic chip thermistor element 2, and the undersurface and top surface of the thermistor element 2 other than the parts where the electrodes 6 and 6 are formed are covered with insulating layers 4 and 7 for the formation of a chip thermistor 1. The terminal electrode 6 has a bump structure protruding from the insulating layer 7.