| 摘要 |
PROBLEM TO BE SOLVED: To provide an IC socket wherein a mechanism to elastically receive an IC package is simplified and the performance to elastically receive it is enhanced when the IC package is thrown in. SOLUTION: Three sets or more of elastically supporting pin mechanisms 14 composed of a stepped pin 15 and a coil spring 16 to drive this stepped pin 15 upward are installed at a socket base structure 5 of the IC socket 1, and constituted so that the IC package 2 will be received by these elastically supporting pin mechanisms 14. In a state that the IC package 2 is conveyed by a handler and elastically supported by the stepped pins 15 of the three sets of the elastically supporting pin mechanisms 14, the IC package 2 is pushed downward and lead terminal 3 is brought into contact with a contact blade 13.
|
