| 摘要 |
PROBLEM TO BE SOLVED: To provide a base of a wiring circuit board, which makes it possible to effectively prevent warpage and variation in dimensions and is efficiently manufactured without increase in man-hours, and to provide a wiring circuit board using the base for wiring circuit board. SOLUTION: A resin composition of a base containing a polyimide resin precursor and a tertiary amine compound is prepared and applied to metal foil 1. The resin composition is then dried and cured to form a base insulating film 3, thereby obtaining a two-layered base 4. The metal foil 1 of the two- layered base 4 is patterned into a desired wiring circuit pattern to obtain a wiring circuit board 6. |
