MANUFACTURING METHOD FOR RESIN-SEALING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To overcome such a problem that an exposed lead is rubbed against the sealing resin surface provided below it and scratched when a lead frame is laminated and housed for transportation after its one surface is sealed. SOLUTION: The upper surface of a lead frame 3 is sealed with a sealing resin 6 while a resin projection 8 is formed of the resin sealing 6 in the extra space above the lead frame 3. At the transportation of the lead frame for the next process, a plurality of lead frames 3 are laminated with the formed resin projections 8 used as a support. Thus, a lead 2 exposed from the lower surface of the lead frame 3 does not directly contact the sealing resin 6, thus preventing scratches of the plating layer of the lead 2.