| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring circuit board which can be improved in connection reliability by smoothing the rugged surface of a laminated insulating layer, and to provide a method of manufacturing the same. SOLUTION: A photosensitive resin film 16p is formed on a first insulation layer 11 and a first conductor layer 12; a photomask 19 equipped with a light- shading region 20, a light transmission region 21, and a light semi-transmitting region 22 is used; the light shading region 20, the light transmission region 21, and the light semi-transmission region 22 are each arranged, so as to confront the opening 23, an insulating laminate part 18, and a conductor laminate part 17 of the film 16P respectively; and the film 16p is exposed to light, developed and cured through heating, by which the second insulating layer 16 is formed, so as to make the conductor laminate part 17 laminated on the first conductor layer 12 thinner than the insulating laminate part 18 laminated on the first insulation layer 11. |
