发明名称 |
STRUCTURE AND MANUFACTURING METHOD OF LAMINATED CHIP TYPE ELECTRONIC COMPONENT |
摘要 |
PROBLEM TO BE SOLVED: To provide a pole mark which shows the direction of a pole at a low cost in a form not to distinguish the pole mark in a laminated chip type electronic component such as a laminated chip type capacitor formed by laminating a plurality of ceramic sheets wherein an inner electrode film is formed. SOLUTION: A through hole 4 is formed in at least one ceramic sheet positioned in an uppermost layer of each ceramic sheet and thereby a pole mark 3 is provided to a bottom of the through hole 4. Alternately, a pole mark 3' is formed by shaping a recessed hole 4' in a ceramic sheet of the uppermost layer and charging the recessed hole 4' with materials of different colors.
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申请公布号 |
JP2003007573(A) |
申请公布日期 |
2003.01.10 |
申请号 |
JP20010194127 |
申请日期 |
2001.06.27 |
申请人 |
ROHM CO LTD |
发明人 |
MORITA HIROHISA;AMAYA MINORU |
分类号 |
H01G4/12;H01G4/30;H01G13/00;(IPC1-7):H01G13/00 |
主分类号 |
H01G4/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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