发明名称 STRUCTURE AND MANUFACTURING METHOD OF LAMINATED CHIP TYPE ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a pole mark which shows the direction of a pole at a low cost in a form not to distinguish the pole mark in a laminated chip type electronic component such as a laminated chip type capacitor formed by laminating a plurality of ceramic sheets wherein an inner electrode film is formed. SOLUTION: A through hole 4 is formed in at least one ceramic sheet positioned in an uppermost layer of each ceramic sheet and thereby a pole mark 3 is provided to a bottom of the through hole 4. Alternately, a pole mark 3' is formed by shaping a recessed hole 4' in a ceramic sheet of the uppermost layer and charging the recessed hole 4' with materials of different colors.
申请公布号 JP2003007573(A) 申请公布日期 2003.01.10
申请号 JP20010194127 申请日期 2001.06.27
申请人 ROHM CO LTD 发明人 MORITA HIROHISA;AMAYA MINORU
分类号 H01G4/12;H01G4/30;H01G13/00;(IPC1-7):H01G13/00 主分类号 H01G4/12
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