| 发明名称 |
Lead-free solder |
| 摘要 |
Lead-free solder comprising Sn, Zn and 0.001 to 0.005 wt. % Ti. The lead-free solder does not contain toxic lead, and has sufficient bonding strength to oxide materials such as glass and ceramics.
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| 申请公布号 |
US2003007885(A1) |
申请公布日期 |
2003.01.09 |
| 申请号 |
US20020170193 |
申请日期 |
2002.06.13 |
| 申请人 |
DOMI SHINJIRO;SAKAGUCHI KOICHI;NAKAGAKI SHIGEKI;SUGANUMA KATSUAKI |
发明人 |
DOMI SHINJIRO;SAKAGUCHI KOICHI;NAKAGAKI SHIGEKI;SUGANUMA KATSUAKI |
| 分类号 |
B23K35/26;B23K35/28;(IPC1-7):C22C13/00;C22C13/00 |
主分类号 |
B23K35/26 |
| 代理机构 |
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代理人 |
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