发明名称 A MODULAR STRUCTURE FOR HOUSING ELECTRONIC EQUIPMENT, A METHOD FOR PROVIDING AN ENCLOSURE FOR ELECTRONIQUE EQUIPMENT, USE OF SAID MODULAR STRUCTURE AND A HOUSING FOR ELECTRONIC EQUIPMENT
摘要 The present invention refers to housing electronic equipment in an enclosure (1) comprising at least a roof element, two side wall elements (2-7) and two end wall elements (8, 9). At least one of the side wall elements (2-7) comprise a locking device (15) for fastening the side wall element (2-7) to an end wall element (8, 9). The present invention also refers to a method for providing an enclosure for electronic equipment in a space inside an existing building and to a housing for enclosing electronic equipment. The modular structure may be used to house a radio or mobile telephone system base station as well as other electronic equipment.
申请公布号 WO03003801(A1) 申请公布日期 2003.01.09
申请号 WO2001SE02661 申请日期 2001.12.03
申请人 ABB AB;EDLER, BOERJE 发明人 EDLER, BOERJE
分类号 H04Q1/02;H05K7/18;(IPC1-7):H05K5/00 主分类号 H04Q1/02
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