发明名称 |
Method of manufacturing mount structure without introducing degraded bonding strength of electronic parts due to segregation of low-strength/low-melting point alloy |
摘要 |
A method of manufacturing a mount structure according to the present invention which forcedly cools down a melted solder paste on a printed circuit board at a cooling speed of 1.5° C./second or higher to solidify the solder paste when an electronic part is mounted on the printed circuit board by reflow processing.
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申请公布号 |
US2003005581(A1) |
申请公布日期 |
2003.01.09 |
申请号 |
US20020156098 |
申请日期 |
2002.05.29 |
申请人 |
WATANABE SHINJI;SAKAI HIROSHI;SUZUKI MOTOJI;IGARASHI MAKOTO;TANAKA AKIHIRO |
发明人 |
WATANABE SHINJI;SAKAI HIROSHI;SUZUKI MOTOJI;IGARASHI MAKOTO;TANAKA AKIHIRO |
分类号 |
H05K3/34;(IPC1-7):B23P19/00;H05K1/16 |
主分类号 |
H05K3/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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