| 发明名称 |
AN ELECTRONIC PACKAGE HAVING A SUBSTRATE WITH ELECTRICALLY CONDUCTIVE FILLED THROUGH HOLES |
| 摘要 |
The present invention provides a unique conductive composition for filling vias or through holes to make reliable vertical or Z-connects. The through holes may be plated or unplated prior to filling. A description for making high density electronic packaging using this feature is also disclosed. |
| 申请公布号 |
US2003006066(A1) |
申请公布日期 |
2003.01.09 |
| 申请号 |
US19990345428 |
申请日期 |
1999.07.01 |
| 申请人 |
APPELT BERND K.;GELORME JEFFREY D.;KANG SUNG KWON;MARKOVICH VOYA R.;PAPATHOMAS KOSTAS;PURUSHOTHAMAN SAMPATH |
发明人 |
APPELT BERND K.;GELORME JEFFREY D.;KANG SUNG KWON;MARKOVICH VOYA R.;PAPATHOMAS KOSTAS;PURUSHOTHAMAN SAMPATH |
| 分类号 |
H01B1/02;H01B1/22;H01L23/498;H05K1/09;H05K3/40;(IPC1-7):H05K1/11;H01K3/10;H01R12/04 |
主分类号 |
H01B1/02 |
| 代理机构 |
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