发明名称 |
COMPUTER WITH THERMAL COOLING AND A THERMAL COOLING SYSTEM AND METHOD |
摘要 |
A thermal cooling system in which a clamp assembly clamps a heat dissipating device to a generating device in the chassis of an electrical device. The clamp assembly ensures that the heat dissipating device exerts a relatively high, constant, uniform pressure on the heat generating device to ensure maximum heat transfer from the heat generating device to the heat dissipating device.
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申请公布号 |
US2003007324(A1) |
申请公布日期 |
2003.01.09 |
申请号 |
US20010756944 |
申请日期 |
2001.01.09 |
申请人 |
CEPEDA DARIN;ESCAMILLA EDUARDO;FRAGA JOHNNY |
发明人 |
CEPEDA DARIN;ESCAMILLA EDUARDO;FRAGA JOHNNY |
分类号 |
G06F1/20;H01L23/367;H01L23/40;H05K7/20;(IPC1-7):G06F1/16;H05K5/00;H05K7/00 |
主分类号 |
G06F1/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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