发明名称 COMPUTER WITH THERMAL COOLING AND A THERMAL COOLING SYSTEM AND METHOD
摘要 A thermal cooling system in which a clamp assembly clamps a heat dissipating device to a generating device in the chassis of an electrical device. The clamp assembly ensures that the heat dissipating device exerts a relatively high, constant, uniform pressure on the heat generating device to ensure maximum heat transfer from the heat generating device to the heat dissipating device.
申请公布号 US2003007324(A1) 申请公布日期 2003.01.09
申请号 US20010756944 申请日期 2001.01.09
申请人 CEPEDA DARIN;ESCAMILLA EDUARDO;FRAGA JOHNNY 发明人 CEPEDA DARIN;ESCAMILLA EDUARDO;FRAGA JOHNNY
分类号 G06F1/20;H01L23/367;H01L23/40;H05K7/20;(IPC1-7):G06F1/16;H05K5/00;H05K7/00 主分类号 G06F1/20
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