| 摘要 |
PURPOSE: A clad lead for a semiconductor and ceramic package thereof are provided to compact the total size of the semiconductor and the ceramic package and simplify the production process of them. CONSTITUTION: A ceramic package includes package body(10), a semiconductor chip and solder balls(30) and a clad lead(40). The package body has a rectangular shape and a step height part(11) is formed around the body. The clad lead is attached to the surface of the step height part to make the ceramic package airtight. The clad lead is made by spreading clad powder or coating nickel or nickel- phosphorus on a cold strip iron mill beaten to be a predetermined shape.
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