| 摘要 |
PURPOSE: To provide a cyanide-free gold substitution plating solution, which can perform gold substitution plating even onto an electroless nickel-boron plated film or an electrolytically plated film of nickel, to impart it adequate adhesiveness and solderability. CONSTITUTION: The gold substitution plating solution includes gold sodium sulfite or ethylenediamine complex of gold sodium sulfite of 0.01-1.0 g/L in terms of gold concentration, sulfite of 10-100 g/L, organic carboxylic acid or a salt thereof of 5-50 g/L, and ethylene diamine tetraacetic acid or a salt thereof of 5-50 g/L, and has pH of 4.5-6.0 of a weak acid region.
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