发明名称 METHOD FOR EMBOSSING RESIN FILM
摘要 PROBLEM TO BE SOLVED: To provide a method for embossing a resin film by which the resin film is smoothly stretched so that a molding surface is cleanly finished and a residual stress is eliminated and thereby, a postmolding shape is stabilized by internally generating heat due to ultrasonic vibration and the smooth release of a die after molding is achieved. SOLUTION: The resin film F is thermally softened at a temperature close to its melting point and the die 3a is pressed to the resin film F while the ultrasonic vibration is applied to the die 3a. After that, when the die 3a reaches a final pressing position, application of the ultrasonic vibration is stopped and the die 3a is kept at the final pressing position for a specified time. Following this step, the die 3a is released from the resin film while the ultrasonic vibration is applied to the die 3a.
申请公布号 JP2003001700(A) 申请公布日期 2003.01.08
申请号 JP20010192361 申请日期 2001.06.26
申请人 DAIICHI SEIKO KK 发明人 OBA HIDEYOSHI;MATSUMOTO MASANOBU;TAKEO KOICHI
分类号 B65B15/04;B29C51/08;B29C51/30;(IPC1-7):B29C51/08 主分类号 B65B15/04
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