| 摘要 |
PURPOSE: An etching device is provided to improve a uniformity of patterns by using a double spray plate. CONSTITUTION: The etching device comprises a supporter(16) for loading a wafer(15) in a chamber(11), a gas supply pipe(12) for supplying an etch gas, the first spray plate(19) connected to the gas supply pipe(12), and a plurality of spray pipes(18) connected to the first spray plate(19). The apparatus further includes the second spray plate(13). The second spray plate(13) is connected to the spray pipes(18), and a plurality of spray holes(14) are formed at lower part of the second spray plate(13). Thereby, the etch gas is uniformly sprayed into the surface of the wafer(15) via the first spray plate(19), the spray pipes(18), the second spray plate(13) and the spray holes(14).
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