发明名称 APPARATUS FOR MEASURING LINEARITY OF ORIENTATION FLAT OF WAFER
摘要 PROBLEM TO BE SOLVED: To accurately measure the linearity of orientation flat in a short time. SOLUTION: A linear track 11a is formed on a base 11 in a first direction. The upper surface of a platform 18 is made flat to place a wafer 18 having an orientation flat 18a, an the platform is engaged with the linear track by means of an engaging means 12 and a moves along the first direction. A block 19, with which the orientation flat of the wafer is brought into contact and which is provided with a flat surface 19a parallel to the first direction, is fitted to the base at a first interval L with the linear track in a second direction, crossing orthogonally the first direction. A wafer fixing means 34 which fixes a wafer, while placing it on the platform is provided on the platform, and a probe 39 which is displaceable in the second direction opposite to the linear track is fitted to the base at a second interval M with the block in the first direction. Defining the interval between the tip of a probe and the linear track as N, the inequality 0μm<(L-N)<=100μm holds.
申请公布号 JP2003004406(A) 申请公布日期 2003.01.08
申请号 JP20010183702 申请日期 2001.06.18
申请人 MITSUBISHI MATERIALS SILICON CORP;MITSUBISHI SILICON AMERICA CORP 发明人 KOHANEK CINDY;BABB GARY
分类号 G01B5/20;H01L21/00;(IPC1-7):G01B5/20 主分类号 G01B5/20
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