发明名称 |
METHOD FOR FABRICATING INSULATION LAYER FOR MAGNETIC RANDOM ACCESS MEMORY |
摘要 |
PURPOSE: A method for fabricating an insulation layer for a magnetic random access memory(MRAM) is provided to increase reliability and integration by filling a hole having no void regardless of an increased aspect ratio of a storage layer. CONSTITUTION: A magnetic tunneling adhesive layer and a passivation layer are sequentially formed on a substrate(1). A pretreatment process is performed to planarize the passivation layer. An insulation layer(6) is formed on the passivation layer by a low pressure chemical vapor deposition(LPCVD) method. An after-treatment process is performed by an in-situ process. A capping insulation layer is formed on the insulation layer. A heat treatment process is performed.
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申请公布号 |
KR20030002120(A) |
申请公布日期 |
2003.01.08 |
申请号 |
KR20010038861 |
申请日期 |
2001.06.30 |
申请人 |
HYNIX SEMICONDUCTOR INC. |
发明人 |
AHN, SANG TAE |
分类号 |
H01L21/31;(IPC1-7):H01L21/31 |
主分类号 |
H01L21/31 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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