发明名称 METHOD FOR FABRICATING INSULATION LAYER FOR MAGNETIC RANDOM ACCESS MEMORY
摘要 PURPOSE: A method for fabricating an insulation layer for a magnetic random access memory(MRAM) is provided to increase reliability and integration by filling a hole having no void regardless of an increased aspect ratio of a storage layer. CONSTITUTION: A magnetic tunneling adhesive layer and a passivation layer are sequentially formed on a substrate(1). A pretreatment process is performed to planarize the passivation layer. An insulation layer(6) is formed on the passivation layer by a low pressure chemical vapor deposition(LPCVD) method. An after-treatment process is performed by an in-situ process. A capping insulation layer is formed on the insulation layer. A heat treatment process is performed.
申请公布号 KR20030002120(A) 申请公布日期 2003.01.08
申请号 KR20010038861 申请日期 2001.06.30
申请人 HYNIX SEMICONDUCTOR INC. 发明人 AHN, SANG TAE
分类号 H01L21/31;(IPC1-7):H01L21/31 主分类号 H01L21/31
代理机构 代理人
主权项
地址