| 摘要 |
A CMP machine of the invention includes first and second polishing bases 14 and 15, first and second wafer holding heads 31 and 32, a wafer loading unit 41, a wafer unloading unit 42, first and second head rotating mechanism rotating the first and second wafer holding heads so as to position then above the first and second polishing bases, wafer loading unit, or wafer unloading unit, a first transportation mechanism transporting an unpolished wafer to the wafer loading unit, and a second transportation mechanism, transporting a polished wafer from the wafer unloading unit. The first and second polishing bases are located mutually adjacently, the wafer loading unit and wafer unloading unit are located mutually adjacently, the first polishing base and wafer loading unit are located diagonally, the second polishing base and wafer unloading unit are located diagonally. Owing to this structure, transportation of a wafer to the wafer loading unit and transportation of a wafer from the wafer unloading unit are achieved by the different transportation mechanisms. This leads to a minimized adhesion of dust to an unpolished wafer. |
