发明名称 Semiconductor device and method for fabricating the same
摘要 A semiconductor device includes a substrate, a multi-layer structure provided on the substrate, a first-conductive-type etch stop layer of a III nitride provided on the multi-layer structure, and a second-conductive-type first semiconductor layer of a III nitride provided on the etch stop layer. A molar fraction of Al is lower in a composition of the III nitride included in the first semiconductor layer than in a composition of the III nitride included in the etch stop layer.
申请公布号 US6503769(B2) 申请公布日期 2003.01.07
申请号 US19990420722 申请日期 1999.10.20
申请人 MATSUSHITA ELECTRONICS CORPORATION 发明人 NAKAMURA SHINJI;YURI MASAAKI;ORITA KENJI
分类号 H01S5/30;H01L33/00;H01L33/06;H01L33/14;H01L33/32;H01S5/323;H01S5/343;(IPC1-7):H01L21/20 主分类号 H01S5/30
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