Method of rinsing residual etching reactants/products on a semiconductor wafer

摘要

An etching machine comprises a cleaning solution sprayer, further comprising at least a first nozzle positioned above a center of the wafer and a second nozzle positioned above an edge of the wafer. The semiconductor wafer is spun and simultaneously a cleaning solution is sprayed on the center and the edge of the wafer via the first nozzle and the second nozzle, respectively, to evenly rinse the residual etching solution on the surface of the wafer. The semiconductor wafer is spun dry with a nitrogen purge on the wafer surface at the end of the method.