SEMICONDUCTOR SUBSTRATE FOR BALL GRID ARRAY PACKAGE

摘要

PURPOSE: A semiconductor substrate for ball grid array package is provided to prevent a crack of a solder resist due to a mold and singulation process by adding a dummy pattern to a practical pattern. CONSTITUTION: A dummy pattern(100) is added to a practical pattern(12). The dummy pattern(100) is formed in a predetermined interval. The dummy pattern(100) is extended to the inside and the outside of a singulation cutting line(51) in order to form uniformly thickness of a substrate. The dummy pattern(100) is not contacted with two or more practical patterns. The width of the dummy pattern(101) extended to the outside of the singulation cutting line(51) is double the width of the practical pattern(12) in order to support a clamping pressure of a mold top and a bottom die. The width of the dummy pattern(101) extended to the inside of the singulation cutting line(51) is equal to or less than the width of the practical pattern(12) in order to prevent a short circuit phenomenon generated between the dummy pattern(101) and the practical pattern(12).