发明名称 TOPOLOGICAL GLOBAL ROUTING FOR AUTOMATED IC PACKAGE INTERCONNECT
摘要 <p>An automated method and system is disclosed to determine an Integrated Circuit (IC) package interconnect routing using a mathematical topological solution. A global topological routing solution is determined to provide singular ideal IC package routing solution. Topological Global Routing provides a mathematical abstraction of the problem that allows multiple optimizations to be performed prior to detailed routing. Preliminary disregard of electrical routing segment width and required clearance allows the global topological solution to be determined quickly. The global topological solution is used in conjunction with necessary design parameters to determine the optimal geometric routing solution. Guide points are determined using the geometric routing solution. A detail router uses the guide points as corners when performing the actual routing.</p>
申请公布号 WO2003001415(A1) 申请公布日期 2003.01.03
申请号 US2002019682 申请日期 2002.06.21
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