Method of mounting electronic parts with Sn-Zn solder free of Pb

摘要

There is disclosed a method of mounting electronic parts with Sn - Zn solder which is Pb-free solder without a reduction in the bonding strength. A printed circuit board for mounting electronic parts with Pb-free solder comprises a printed circuit board whose surface is treated with Ni/Au, having an interconnection pattern of copper foil, a plated layer of Ni disposed on a surface of the copper foil, and a plated layer of Au disposed on a surface of the plated layer of Ni. The plated layer of Ni on the surface of copper foil serves as a barrier layer which prevents a Cu - Zn reaction layer, which would otherwise tend to reduce the bonding strength, from being produced in the soldered joints, when electronic parts are mounted on the printed circuit board using the Sn - Zn solder. <IMAGE>