发明名称 Composition for washing a polishing pad and method for washing a polishing pad
摘要 An object of the present invention is to provide a composition for washing a polishing pad which removes a water-insoluble compound which was separated from a surface to be polished during polishing, formed at least on the surface of a polishing pad, and comprised a metal ion ionized, and a method for washing a polishing pad using the same. The composition for washing a polishing pad of the present invention is obtained by, in the case a water-insoluble compound is a copper quinaldinic acid complex, blending ammonia as a component for rendering the water-insoluble compound water-soluble and glycine as a water-soluble complex forming component for forming a water-soluble complex with a copper ion, and stirring them. In addition, in a method for washing a polishing pad using the composition for washing a polishing pad, a polishing pad can be washed effectively, the productivity can be improved and, further, consumption of a polishing pad can be inhibited.
申请公布号 US2003004085(A1) 申请公布日期 2003.01.02
申请号 US20020166111 申请日期 2002.06.11
申请人 JSR CORPORATION 发明人 ANDO MICHIAKI;KAWAHASHI NOBUO;HATTORI MASAYUKI
分类号 B24B57/02;B24B37/00;B24B53/017;C11D7/02;C11D7/04;C11D7/06;C11D7/26;C11D7/32;C11D11/00;H01L21/304;(IPC1-7):C11D17/00 主分类号 B24B57/02
代理机构 代理人
主权项
地址