Method for masking chips on approximately circular semiconductor wafer for manufacture of electronic circuit, using residual off-cut surfaces for masking further chips of at least one additional type of chip

摘要

A method for masking chips (2) on an approximately partly round semiconductor wafer (1), in which the individual chips (2) are arranged uniformly in rows (4) and columns (5). The structures are fully imaged on the semiconductor wafer (1). The residual off-cut surfaces (X) for masking further chips (3) are at least utilized for a further type of chip, in which the additional chip (3) has a geometrically smaller chip surface than the larger first chips (2). An Independent claim is given for a semiconductor wafer.