发明名称 METHOD AND APPARATUS FOR MOUNTING CHIP
摘要 In bonding bumps formed on a chip to electrodes formed on a substrate in a purge gas atmosphere, purge gas is supplied locally at least around the bumps, with the substrate and the chip separated from each other. According to the method and apparatus for chip mounting, the concentration of purge gas can be increased locally around the bumps where the isolation from the air is required, so that the bumps are protected effectively from secondary oxidation. <IMAGE>
申请公布号 EP1271641(A1) 申请公布日期 2003.01.02
申请号 EP20010912175 申请日期 2001.03.08
申请人 TORAY ENGINEERING CO., LTD. 发明人 TERADA, KATSUMI;YAMAUCHI, AKIRA
分类号 H05K3/34;H01L21/60;(IPC1-7):H01L21/60 主分类号 H05K3/34
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