| 发明名称 |
Semiconductor device incorporating hemispherical solid immersion lens, apparatus and method for manufacturing the same |
| 摘要 |
In a semiconductor device having a front surface where circuits are formed and a back surface, a hemispherical solid immersion lens is formed at the back surface of the semiconductor device in a body with the semiconductor device.
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| 申请公布号 |
US2003000917(A1) |
申请公布日期 |
2003.01.02 |
| 申请号 |
US20020230490 |
申请日期 |
2002.08.29 |
| 申请人 |
NEC CORPORATION |
发明人 |
KITAHATA HIDEKI |
| 分类号 |
G01N21/956;B24B1/00;B28D5/02;H01L21/304;H01L21/66;H01L27/146;(IPC1-7):H01B13/00 |
主分类号 |
G01N21/956 |
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