| 发明名称 |
Semiconductor device and method of manufacture thereof |
| 摘要 |
In order to form an aluminum system wiring that does not peel off on an insulating film containing fluorine and to improve the reliability thereof, a semiconductor device according to the present invention includes an insulating film (14) containing fluorine formed on a substrate (11), a titanium aluminum alloy film (17a) formed on the insulating film (14) containing fluorine, and a metallic film (17b) comprising aluminum or an aluminum alloy formed on the titanium aluminum alloy film (17a).
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| 申请公布号 |
US2003001276(A1) |
申请公布日期 |
2003.01.02 |
| 申请号 |
US20020182661 |
申请日期 |
2002.07.31 |
| 申请人 |
ENOMOTO YOSHIYUKI;KANAMURA RYUICHI |
发明人 |
ENOMOTO YOSHIYUKI;KANAMURA RYUICHI |
| 分类号 |
H01L23/52;H01L21/312;H01L21/316;H01L21/3205;H01L21/4763;H01L21/768;H01L23/48;H01L23/522;H01L23/532;(IPC1-7):H01L21/44;H01L29/40 |
主分类号 |
H01L23/52 |
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