发明名称 |
Manufacturing method for a flexible PCB |
摘要 |
A manufacturing method for a flexible PCB includes steps of forming a copper circuit on a first surface of a polyimide backing, removing unwanted polyimide by a laser processing to expose the copper circuit on a second surface of the backing, removing leavings of polyimide generated by the laser processing, and making a surface treatment to the copper circuit exposed at the second surface of the backing.
|
申请公布号 |
US2003002264(A1) |
申请公布日期 |
2003.01.02 |
申请号 |
US20020159027 |
申请日期 |
2002.06.03 |
申请人 |
UFLEX TECHNOLOGY CO., LTD. |
发明人 |
YANG TE-SHENG;LIU CHI-RONG;HSU KUO-CHIN |
分类号 |
H05K1/00;H05K3/00;(IPC1-7):H05K1/00 |
主分类号 |
H05K1/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|