发明名称 Manufacturing method for a flexible PCB
摘要 A manufacturing method for a flexible PCB includes steps of forming a copper circuit on a first surface of a polyimide backing, removing unwanted polyimide by a laser processing to expose the copper circuit on a second surface of the backing, removing leavings of polyimide generated by the laser processing, and making a surface treatment to the copper circuit exposed at the second surface of the backing.
申请公布号 US2003002264(A1) 申请公布日期 2003.01.02
申请号 US20020159027 申请日期 2002.06.03
申请人 UFLEX TECHNOLOGY CO., LTD. 发明人 YANG TE-SHENG;LIU CHI-RONG;HSU KUO-CHIN
分类号 H05K1/00;H05K3/00;(IPC1-7):H05K1/00 主分类号 H05K1/00
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