发明名称 |
POROUS ADHESIVE SHEET, SEMICONDUCTOR WAFER WITH POROUS ADHESIVE SHEET, AND METHOD OF MANUFACTURE THEREOF |
摘要 |
A porous adhesive sheet 1 having plural through holes 2 running in about parallel with each other in the thickness direction A of an adhesive organic film 3, wherein the through holes have about congruent sections in the diameter direction from one opening 2a to the other opening 2b and a production method thereof, and a semiconductor wafer with a porous adhesive sheet 31, which includes a semiconductor wafer 32 having an electrode 33, the porous adhesive sheet 1 adhered to the semiconductor wafer, and a conductive part 34 formed by filling a through hole 2 located on the electrode 33 with a conductive material, and a production method thereof are provided. |
申请公布号 |
EP1270694(A1) |
申请公布日期 |
2003.01.02 |
申请号 |
EP20000953509 |
申请日期 |
2000.08.18 |
申请人 |
NITTO DENKO CORPORATION |
发明人 |
YAMAGUCHI, MIHO;HOTTA, YUJI |
分类号 |
C09J7/00;C09J7/02;H01L21/56;H01L21/60;H01L23/14;H01L23/31;H01R4/04 |
主分类号 |
C09J7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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