发明名称 |
Method for fabricating a stacked semiconductor chip package |
摘要 |
A stacked semiconductor chip package includes: a substrate including a plurality of conductive pads; a first semiconductor chip mounted on the substrate; and electrically connected to the conductive pads; a plurality of electrical leads provided about the substrate; a first molding part for sealing the substrate and the first semiconductor chip; a second semiconductor chip mounted on an upper surface of the first molding part and electrically connected to the electrical leads; and a second molding part for sealing the second semiconductor chip, the second conductive wires and a portion of the leads.
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申请公布号 |
US6500698(B2) |
申请公布日期 |
2002.12.31 |
申请号 |
US20010977313 |
申请日期 |
2001.10.16 |
申请人 |
HYNIX SEMICONDUCTOR, INC. |
发明人 |
SHIN MYOUNG-JIN |
分类号 |
H01L25/18;H01L23/00;H01L23/31;H01L23/498;H01L25/065;H01L25/07;H01L25/10;(IPC1-7):H01L21/48 |
主分类号 |
H01L25/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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