VACUUM CHUCK FOR FIXING SEMICONDUCTOR WAFER

摘要

PURPOSE: A vacuum chuck for fixing a semiconductor wafer is provided to fix stably the semiconductor wafer by improving a structure of a vacuum absorbing plate of the vacuum chuck. CONSTITUTION: A vacuum chuck(20) comprises a vacuum absorbing plate(22) for absorbing a wafer(60) and a connection portion(24) connected with a rotary portion. The vacuum absorbing plate(22) is branched into a plurality of vacuum plates having a plurality of vacuum absorbing holes(26) in order to widen an area for absorbing the wafer(60). The first vacuum absorbing hole(25) is formed at a center part of the plural vacuum plates(24). The second vacuum absorbing hole(27) is formed in a predetermined interval from the first vacuum absorbing hole(25). The third vacuum absorbing hole is formed at an opposite side to the second vacuum absorbing hole(27). The wafer(60) is stably absorbed by using the three vacuum absorbing hole(26).