SOCKET FOR SEMICONDUCTOR PACKAGE

摘要

A socket (10) for a semiconductor package having a plurality of solder balls (5) at its bottom surface. The socket (10) includes a socket body having a plurality of contacts (11) arranged in a shape to correspond in arrangement to the solder balls (5) of the semiconductor package . Each of the contacts (11) has a first and second contact piece contactable with the corresponding solder ball (5) while clamping the corresponding solder ball (5) from both side. The socket (10) includes a placing plate (13) capable of moving between a first position and a second position. The first, or semiconductor placing, position is where the semiconductor package is placed on the placing plate (13) without contact of the solder balls (5) of the semiconductor package with the first and second contact pieces, and the second, or contact, position is where the solder balls (5) of the placed semiconductor package are contactable with the corresponding first and second contact pieces.