MEMBER FOR FABRICATING SEMICONDUCTOR PACKAGE, FABRICATING METHOD THEREOF, SEMICONDUCTOR PACKAGE USING SUCH MEMBER AND FABRICATING METHOD THEREOF

摘要

PURPOSE: A member for fabricating a semiconductor package is provided to easily embody a fine pitch by forming an inner lead of a lead frame while using metal foil, and to miniaturize the semiconductor package by attaching a semiconductor chip to the member for fabricating the semiconductor package having the metal foil. CONSTITUTION: Only outer leads(14) of the lead frame are formed of a predetermined arrangement. The metal foil(12) is attached to the outer leads, etched to be of a dense arrangement. The attach portion of the outer lead and the metal foil is attached by an attach member(32). A via hole(34) penetrating the attach portion of the outer lead and the metal foil is formed. A conductive coating material(36) is filled in the via hole.