METHOD AND APPARATUS FOR REMOVING INTERCONNECTIONS

摘要

PROBLEM TO BE SOLVED: To provide a method and an apparatus for removing BGA interconnections from a substrate and an interposer for rework. SOLUTION: The method for removing at least one molten or solid structure from a surface is provided with the step of placing the surface with the at least one molten or solid structure in a fixture, the step of disposing a wiper block assembly made to act by bias at a region at least proximally to one molten or solid structure, the step of retaining the wiper block assembly in a first position with a device having a first temperature point level equivalent to or higher than a second melting point level of the at least one molten or solid structure, and the step of raising the temperature of the fixture to the first temperature point level. When the device reaches the first temperature point level, at least the one molten or solid structure is wiped off from the surface.