ETCHING SYSTEM FOR HIGH DIELECTRIC

摘要

PROBLEM TO BE SOLVED: To provide an etching system comprising a substrate holding mechanism in which potential difference between the surface and the rear surface of a substrate of high dielectric material can be kept at a very small level in order to prevent cracking of the substrate at the time of machining. SOLUTION: The part for mounting a substrate is mirror finished in order to increase the contact area between a substrate and the mounting part and a metal film (foil) is formed on the rear surface of a jig for retaining the substrate or a clamp so that a potential difference being generated between the surface and the rear surface of a high dielectric becomes very small during plasma irradiation (etching).