发明名称 Method and apparatus for manufacturing a semiconductor device and processing a substrate
摘要 A substrate processing apparatus includes a CVD (chemical vapor deposition) processing chamber and a RTO (rapid thermal oxidation) processing chamber. In the CVD processing chamber, a film growing process, in which thin amorphous film is deposited on a substrate, and an impurity removing process, in which specific impurities included in the grown amorphous film are removed, are repeatedly performed multiple times to provide an impurity removed amorphous film with good step coverage. Thus treated amorphous film on the substrate is then crystallized in the RTO process chamber to provide a crystalline film.
申请公布号 US2002197828(A1) 申请公布日期 2002.12.26
申请号 US20020106234 申请日期 2002.03.27
申请人 HITACHI KOKUSAI ELECTRIC INC. 发明人 ASAI MASAYUKI;TANAKA TSUTOMU
分类号 H01L21/205;C23C16/40;C23C16/44;C23C16/56;H01L21/31;H01L21/316;H04B10/17;(IPC1-7):H01L21/20;C30B1/00;H01L21/00;H01L21/36 主分类号 H01L21/205
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